Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5112PAP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5112PAPSOT1118HUSON67.26545 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066894115512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01074
FillerSilver (Ag)7440-22-40.0655284.000000.90180
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10736
Isobornyl Methacrylate7534-94-30.003905.000000.05368
subTotal0.07800100.000001.07358
DieDoped siliconSilicon (Si)7440-21-30.42000100.000005.78078
subTotal0.42000100.000005.78078
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.22714
Magnesium (Mg)7439-95-40.005380.200000.07408
Nickel (Ni)7440-02-00.085303.170001.17411
Silicon (Si)7440-21-30.018570.690000.25556
Pure metal layerGold (Au)7440-57-50.000540.020000.00741
Nickel (Ni)7440-02-00.019910.740000.27408
Palladium (Pd)7440-05-30.001880.070000.02593
subTotal2.69100100.0000037.03831
Mould CompoundAdditiveNon hazardousProprietary0.015940.410000.21941
FillerSilica -amorphous-7631-86-90.011280.290000.15519
Silica fused60676-86-03.3495186.1500046.10192
HardenerPhenolic resinProprietary0.166804.290002.29573
PigmentCarbon black1333-86-40.007390.190000.10168
PolymerEpoxy resin systemProprietary0.337098.670004.63962
subTotal3.88800100.0000053.51355
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.25590
subTotal0.16400100.000002.25725
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0244599.990000.33646
subTotal0.02445100.000000.33649
total7.26545100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.