×

Chemical content PBSS8110D

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS8110DSOT457SC-7410.97613 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340579791151312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.11000100.000001.00217
subTotal0.11000100.000001.00217
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.004030.090000.03673
Carbon (C)7440-44-00.001790.040000.01633
Chromium (Cr)7440-47-30.009410.210000.08571
Cobalt (Co)7440-48-40.018820.420000.17143
Iron (Fe)7439-89-62.1109847.1200019.23243
Manganese (Mn)7439-96-50.038080.850000.34693
Nickel (Ni)7440-02-01.5904035.5000014.48962
Phosphorus (P)7723-14-00.000900.020000.00816
Silicon (Si)7440-21-30.011200.250000.10204
Sulphur (S)7704-34-90.000900.020000.00816
Pure metal layerCopper (Cu)7440-50-80.5837413.030005.31830
Silver (Ag)7440-22-40.109762.450000.99999
subTotal4.48000100.0000040.81583
Mould CompoundFillerSilica fused60676-86-04.1322071.0000037.64715
PigmentCarbon black1333-86-40.017460.300000.15907
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.1465419.7000010.44576
Phenolic resinProprietary0.523809.000004.77217
subTotal5.82000100.0000053.02415
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.73708
subTotal0.52000100.000004.73756
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0461299.990000.42022
subTotal0.04613100.000000.42026
total10.97613100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.