Chemical content PDTA115EMB

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Type numberPackagePackage descriptionTotal product weight
PDTA115EMBSOT883BXQFN30.70977 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340659343156126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32123
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04425
Phenolic resinProprietary0.0004113.530000.05719
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.45344
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09468
Copper (Cu)7440-50-80.2632094.0000037.08244
Tin (Sn)7440-31-50.000670.240000.09468
Zinc (Zn)7440-66-60.000590.210000.08284
Pure metal layerGold (Au)7440-57-50.000220.080000.03156
Nickel (Ni)7440-02-00.013834.940001.94880
Palladium (Pd)7440-05-30.000810.290000.11440
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.01765
Silica fused60676-86-00.2040060.0000028.74171
Flame retardantMetal hydroxideProprietary0.010203.000001.43709
ImpurityBismuth (Bi)7440-69-90.001700.500000.23951
PigmentCarbon black1333-86-40.001700.500000.23951
PolymerEpoxy resin systemProprietary0.023807.000003.35320
Phenolic resinProprietary0.020406.000002.87417
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81612
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0067799.990000.95388
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.