×

Chemical content PDTA124XQC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA124XQC-QSOT8009DFN1412D-32.43277 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663496147212601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43736
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.06025
Phenolic resinProprietary0.0018913.530000.07786
subTotal0.01400100.000000.57547
DieDoped siliconSilicon (Si)7440-21-30.05000100.000002.05527
subTotal0.05000100.000002.05527
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.78438
Magnesium (Mg)7439-95-40.001700.145400.06981
Nickel (Ni)7440-02-00.033982.908901.39660
Silicon (Si)7440-21-30.007360.630300.30261
Pure metal layerGold (Au)7440-57-50.000440.037300.01791
Nickel (Ni)7440-02-00.033552.872201.37898
Palladium (Pd)7440-05-30.001480.126700.06083
subTotal1.16800100.0000048.01112
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.64760
Silica fused60676-86-00.8906280.0920036.60942
PigmentCarbon black1333-86-40.010320.928000.42418
PolymerEpoxy resin systemProprietary0.093968.450003.86243
Phenolic resinProprietary0.028362.550001.16558
subTotal1.11200100.0000045.70921
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00189
Tin solderTin (Sn)7440-31-50.0829599.940003.40970
subTotal0.08300100.000003.41174
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0057799.990000.23724
subTotal0.00577100.000000.23726
total2.43277100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.