×

Chemical content PDTA143EQA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA143EQASOT1215DFN1010D-31.13762 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069135147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02637
FillerSilver (Ag)7440-22-40.0252084.000002.21515
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.26371
Isobornyl Methacrylate7534-94-30.001505.000000.13185
subTotal0.03000100.000002.63708
DieDoped siliconSilicon (Si)7440-21-30.03000100.000002.63708
subTotal0.03000100.000002.63708
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.11181
Copper (Cu)7440-50-80.5009094.5100044.03078
Tin (Sn)7440-31-50.001270.240000.11181
Zinc (Zn)7440-66-60.001110.210000.09784
Pure metal layerGold (Au)7440-57-50.000370.070000.03261
Nickel (Ni)7440-02-00.022954.330002.01728
Palladium (Pd)7440-05-30.002120.400000.18635
subTotal0.53000100.0000046.58848
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.0000010.31100
Silica fused60676-86-00.3060060.0000026.89826
Flame retardantMetal hydroxideProprietary0.015303.000001.34491
ImpurityBismuth (Bi)7440-69-90.002550.500000.22415
PigmentCarbon black1333-86-40.002550.500000.22415
PolymerEpoxy resin systemProprietary0.035707.000003.13813
Phenolic resinProprietary0.030606.000002.68983
subTotal0.51000100.0000044.83043
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00012
Non hazardousProprietary0.000020.055500.00146
Tin solderTin (Sn)7440-31-50.0299899.940002.63550
subTotal0.03000100.000002.63708
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0076299.990000.67019
subTotal0.00763100.000000.67026
total1.13762100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.