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Chemical content PDTB113EQA

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Type numberPackagePackage descriptionTotal product weight
PDTB113EQASOT1215DFN1010D-31.21000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069262147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02479
FillerSilver (Ag)7440-22-40.0252084.000002.08264
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.24793
Isobornyl Methacrylate7534-94-30.001505.000000.12397
subTotal0.03000100.000002.47933
DieDoped siliconSilicon (Si)7440-21-30.10000100.000008.26446
subTotal0.10000100.000008.26446
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10512
Copper (Cu)7440-50-80.5009094.5100041.39694
Tin (Sn)7440-31-50.001270.240000.10512
Zinc (Zn)7440-66-60.001110.210000.09198
Pure metal layerGold (Au)7440-57-50.000370.070000.03066
Nickel (Ni)7440-02-00.022954.330001.89661
Palladium (Pd)7440-05-30.002120.400000.17521
subTotal0.53000100.0000043.80164
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.000009.69421
Silica fused60676-86-00.3060060.0000025.28926
Flame retardantMetal hydroxideProprietary0.015303.000001.26446
ImpurityBismuth (Bi)7440-69-90.002550.500000.21074
PigmentCarbon black1333-86-40.002550.500000.21074
PolymerEpoxy resin systemProprietary0.035707.000002.95041
Phenolic resinProprietary0.030606.000002.52893
subTotal0.51000100.0000042.14875
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00138
Tin solderTin (Sn)7440-31-50.0299899.940002.47785
subTotal0.03000100.000002.47934
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0100099.990000.82636
subTotal0.01000100.000000.82644
total1.21000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.