Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTB114ET

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTB114ETSOT23TO-236AB7.81041 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934031090235512601235
934031090215412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.19000100.000002.43265
subTotal0.19000100.000002.43265
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02937
Carbon (C)7440-44-00.001020.040000.01305
Chromium (Cr)7440-47-30.005610.220000.07180
Cobalt (Co)7440-48-40.010960.430000.14033
Iron (Fe)7439-89-61.2230147.9800015.65872
Manganese (Mn)7439-96-50.021920.860000.28067
Nickel (Ni)7440-02-00.9212136.1400011.79463
Phosphorus (P)7723-14-00.000510.020000.00653
Silicon (Si)7440-21-30.006630.260000.08485
Sulphur (S)7704-34-90.000510.020000.00653
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.71071
Silver (Ag)7440-22-40.065512.570000.83874
subTotal2.54900100.0000032.63593
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.81157
Triphenylphosphine603-35-00.002440.050000.03123
FillerSilica -amorphous-7631-86-93.5128872.0000044.97690
PigmentCarbon black1333-86-40.002440.050000.03123
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.37019
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.24679
subTotal4.87900100.0000062.46791
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00131
Tin solderTin (Sn)7440-31-50.1848999.940002.36721
subTotal0.18500100.000002.36863
WirePure metalCopper (Cu)7440-50-80.00741100.000000.09491
subTotal0.00741100.000000.09491
total7.81041100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.