Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD1IVN27-U

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD1IVN27-USOT323SC-705.91473 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340702761154126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000001.18349
subTotal0.07000100.000001.18349
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002030.100000.03435
Carbon (C)7440-44-00.001020.050000.01718
Chromium (Cr)7440-47-30.002030.100000.03435
Cobalt (Co)7440-48-40.010160.500000.17177
Iron (Fe)7439-89-61.0505451.7000017.76149
Manganese (Mn)7439-96-50.016260.800000.27484
Nickel (Ni)7440-02-00.8128040.0000013.74196
Phosphorus (P)7723-14-00.000510.025000.00859
Silicon (Si)7440-21-30.006100.300000.10306
Sulphur (S)7704-34-90.000510.025000.00859
Pure metal layerCopper (Cu)7440-50-80.089414.400001.51162
Silver (Ag)7440-22-40.040642.000000.68710
subTotal2.03200100.0000034.35490
Mould CompoundFillerSilica fused60676-86-02.6803275.1000045.31600
PigmentCarbon black1333-86-40.010710.300000.18102
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6245817.5000010.55965
Phenol Formaldehyde resin (generic)9003-35-40.253407.100004.28420
subTotal3.56900100.0000060.34087
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00020
Tin solderTin (Sn)7440-31-50.2399899.990004.05726
subTotal0.24000100.000004.05766
WirePure metalCopper (Cu)7440-50-80.00372100.000000.06298
subTotal0.00372100.000000.06298
total5.91473100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.