Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD32VF1BLS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD32VF1BLS-QSOD882BDDFN1006-20.905660 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665352315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01748076.0000001.930084
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00240810.4700000.265894
Phenolic resinProprietary0.00311213.5300000.343606
subTotal0.023000100.0000002.539584
DieDoped siliconSilicon (Si)7440-21-30.042000100.0000004.637502
subTotal0.042000100.0000004.637502
Lead FrameCopper alloyCopper (Cu)7440-50-80.38252095.63000042.236601
Magnesium (Mg)7439-95-40.0006000.1500000.066250
Nickel (Ni)7440-02-00.0119202.9800001.316167
Silicon (Si)7440-21-30.0026000.6500000.287083
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004417
Nickel (Ni)7440-02-00.0022000.5500000.242917
Palladium (Pd)7440-05-30.0001200.0300000.013250
subTotal0.400000100.00000044.166685
Mould CompoundFillerSilica -amorphous-7631-86-90.0323997.9800003.577369
Silica fused60676-86-00.32517480.09200035.904591
PigmentCarbon black1333-86-40.0037680.9280000.416015
PolymerEpoxy resin systemProprietary0.0343078.4500003.788066
Phenolic resinProprietary0.0103532.5500001.143144
subTotal0.406000100.00000044.829185
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000154
Non hazardousProprietary0.0000170.0555000.001900
Tin solderTin (Sn)7440-31-50.03098199.9400003.420864
subTotal0.031000100.0000003.422918
WireImpurityNon hazardousProprietary0.0000000.0100000.000040
Pure metalGold (Au)7440-57-50.00366099.9900000.404085
subTotal0.003660100.0000000.404125
total0.905660100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.