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Chemical content PESD3V3L2UM

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Type numberPackagePackage descriptionTotal product weight
PESD3V3L2UMSOT883XQFN30.87712 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340577823151612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86647
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11937
Phenolic resinProprietary0.0013513.530000.15425
subTotal0.01000100.000001.14009
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.70047
subTotal0.05000100.000005.70047
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.79339
Magnesium (Mg)7439-95-40.000630.146000.07158
Nickel (Ni)7440-02-00.012532.913001.42807
Silicon (Si)7440-21-30.002710.631000.30934
MetallisationGold (Au)7440-57-50.000150.035000.01716
Nickel (Ni)7440-02-00.011852.755001.35061
Palladium (Pd)7440-05-30.000470.110000.05393
subTotal0.43000100.0000049.02408
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.70221
Silica fused60676-86-00.2220060.0000025.31011
Flame retardantMetal hydroxideProprietary0.011103.000001.26551
ImpurityBismuth (Bi)7440-69-90.001850.500000.21092
PigmentCarbon black1333-86-40.001850.500000.21092
PolymerEpoxy resin systemProprietary0.025907.000002.95285
Phenolic resinProprietary0.022206.000002.53101
subTotal0.37000100.0000042.18353
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.13941
subTotal0.01000100.000001.14009
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0071299.990000.81167
subTotal0.00712100.000000.81175
total0.87712100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.