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Chemical content PESD3V3L4UF

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Type numberPackagePackage descriptionTotal product weight
PESD3V3L4UFSOT886 dummy POVXSON61.93840 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340611941151012601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0380076.000001.96038
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0052410.470000.27007
Phenolic resinProprietary0.0067613.530000.34900
subTotal0.05000100.000002.57945
DieDoped siliconSilicon (Si)7440-21-30.05000100.000002.57945
subTotal0.05000100.000002.57945
Lead FrameCopper alloyCopper (Cu)7440-50-80.7244391.7000037.37258
Magnesium (Mg)7439-95-40.001340.170000.06928
Nickel (Ni)7440-02-00.024173.060001.24711
Silicon (Si)7440-21-30.005450.690000.28121
Pure metal layerGold (Au)7440-57-50.000470.060000.02445
Nickel (Ni)7440-02-00.031203.950001.60983
Palladium (Pd)7440-05-30.002920.370000.15079
subTotal0.79000100.0000040.75525
Mould CompoundFillerSilica -amorphous-7631-86-90.2300023.0000011.86546
Silica fused60676-86-00.6000060.0000030.95336
Flame retardantMetal hydroxideProprietary0.030003.000001.54767
ImpurityBismuth (Bi)7440-69-90.005000.500000.25794
PigmentCarbon black1333-86-40.005000.500000.25794
PolymerEpoxy resin systemProprietary0.070007.000003.61123
Phenolic resinProprietary0.060006.000003.09534
subTotal1.00000100.0000051.58894
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.54751
subTotal0.03000100.000001.54768
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0184099.990000.94914
subTotal0.01840100.000000.94923
total1.93840100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.