Chemical content PESD3V3L5UF

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Type numberPackagePackage descriptionTotal product weight
PESD3V3L5UFdummy POV SOT886XSON61.98960 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934061195115912601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0152076.000000.76397
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0020910.470000.10525
Phenolic resinProprietary0.0027113.530000.13601
DieDoped siliconSilicon (Si)7440-21-30.06000100.000003.01568
Lead FrameCopper alloyCopper (Cu)7440-50-80.7325893.9200036.82027
Magnesium (Mg)7439-95-40.001560.200000.07841
Nickel (Ni)7440-02-00.024413.130001.22708
Silicon (Si)7440-21-30.005380.690000.27051
Pure metal layerGold (Au)7440-57-50.000230.030000.01176
Nickel (Ni)7440-02-00.014511.860000.72919
Palladium (Pd)7440-05-30.001330.170000.06665
Mould CompoundFillerSilica -amorphous-7631-86-90.2484023.0000012.48492
Silica fused60676-86-00.6480060.0000032.56936
Flame retardantMetal hydroxideProprietary0.032403.000001.62847
ImpurityBismuth (Bi)7440-69-90.005400.500000.27141
PigmentCarbon black1333-86-40.005400.500000.27141
PolymerEpoxy resin systemProprietary0.075607.000003.79976
Phenolic resinProprietary0.064806.000003.25694
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000020.055500.00084
Tin solderTin (Sn)7440-31-50.0299899.940001.50694
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0196099.990000.98502
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.