Chemical content PESD5V0H2BFL-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934669027303	PESD5V0H2BFL-QZ	PESD5V0H2BFL-Q	SOT8079L-1 (DFN1006L-3)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1081 ppm; substance 7440-02-0: 342 ppm; substance 65997-17-3: 130605 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1081 ppm; substance 7440-02-0: 342 ppm; substance 75980-60-8: 7 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 43 ppm; substance 7440-57-5: 157 ppm; substance 7440-05-3: 1028 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.043420	78.944561	6.432593
Die	Pure metal	Copper (Cu)	7440-50-8	0.003981	7.238568	0.589778
Die	Additive	Quartz (SiO2)	14808-60-7	0.003730	6.782626	0.552592
Die	Tin alloy	Tin (Sn)	7440-31-5	0.001607	2.922341	0.238074
Die	Additive	Non-declarable		0.001136	2.065941	0.168296
Die	Polymer	Polyimide resin		0.001052	1.910902	0.155852
Die	Pure metal layer	Copper (Cu)	7440-50-8	0.000040	0.072386	0.005926
Die	Tin alloy	Silver (Ag)	7440-22-4	0.000029	0.053566	0.004296
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.000005	0.009109	0.000741
		Die Total		0.055000	100.000000	8.148148

Mould Compound	Filler	Silica fused	60676-86-0	0.080300	55.000000	11.896296
Mould Compound	Filler	Silica	7631-86-9	0.043800	30.000000	6.488889
Mould Compound	Polymer	Phenolic resin		0.008760	6.000000	1.297778
Mould Compound	Polymer	Epoxy resin system		0.008030	5.500000	1.189630
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.004380	3.000000	0.648889
Mould Compound	Pigment	Carbon black	1333-86-4	0.000730	0.500000	0.108148
		Mould Compound Total		0.146000	100.000000	21.629630

Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.000054	0.011490	0.008000
		Foil Total		0.000054	0.011490	0.008000
Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.000231	0.048810	0.034222
		Plating 1 Total		0.000231	0.048810	0.034222
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.000106	0.022440	0.015704
		Plating 2 Total		0.000106	0.022440	0.015704
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.000694	0.146350	0.102815
		Plating 3 Total		0.000694	0.146350	0.102815
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.002584	0.545100	0.382815
		Plating 4 Total		0.002584	0.545100	0.382815
Substrate/Laminate	Pure metal layer	Titanium (Ti)	7440-32-6	0.000004	0.000870	0.000592
		Plating 5 Total		0.000004	0.000870	0.000592
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.265734	56.061980	39.368000
Substrate/Laminate	Impurity	Phosphorus (P)	7723-14-0	0.000467	0.098770	0.069185
		Plating 6 Total		0.266201	56.160750	39.437185
Substrate/Laminate	Fiberglass	Glass, oxide, chemicals (fibrous)	65997-17-3	0.088159	18.598850	13.060593
Substrate/Laminate	Polymer	Resin system		0.077140	16.274220	11.428148
Substrate/Laminate	Filler	Calcium fluoride	7789-75-5	0.000021	0.004430	0.003111
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000001	0.000120	0.000148
		Pre-preg Total		0.165321	34.877620	24.492000
Substrate/Laminate	Polymer	Acrylic resin		0.020404	4.304610	3.022815
Substrate/Laminate	Flame retardant	Barium sulfate (BaSO4)	7727-43-7	0.014162	2.987850	2.098074
Substrate/Laminate	Additive	Non-declarable		0.002249	0.474550	0.333185
Substrate/Laminate	Additive	Talc	14807-96-6	0.001666	0.351510	0.246815
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.000292	0.061520	0.043259
Substrate/Laminate	Impurity	2-Benzyl-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone	119313-12-1	0.000020	0.004130	0.002963
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000007	0.001430	0.001037
Substrate/Laminate	Impurity	(2,4,6-Trimethylbenzoyl)diphenylphosphine oxide	75980-60-8	0.000005	0.000970	0.000741
		Solder Mask Total		0.038805	8.186570	5.748889
		Substrate/Laminate Total		0.474000	100.000000	70.222222

		PESD5V0H2BFL-Q Total		0.675000		100.000000

Notes
Report created on 2025-10-20 14:20:49 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-10-20 14:20:49 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
铜箔 (Foil)	◯	◯	◯	◯	◯	◯
镀层1 (Plating 1)	◯	◯	◯	◯	◯	◯
镀层2 (Plating 2)	◯	◯	◯	◯	◯	◯
镀层3 (Plating 3)	◯	◯	◯	◯	◯	◯
镀层4 (Plating 4)	◯	◯	◯	◯	◯	◯
镀层5 (Plating 5)	◯	◯	◯	◯	◯	◯
镀层6 (Plating 6)	◯	◯	◯	◯	◯	◯
黏合胶片 (Pre-preg)	◯	◯	◯	◯	◯	◯
防焊绿漆 (Solder Mask)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-10-20 14:20:49 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content PESD5V0H2BFL-Q

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD5V0H2BFL-Q