Chemical content PHPT60610PY

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Type numberPackagePackage descriptionTotal product weight
PHPT60610PYSOT669LFPAK77.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340685841154126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.41000100.000001.81889
ClipCopper alloyCopper (Cu)7440-50-84.9900099.800006.43705
Iron (Fe)7439-89-60.007500.150000.00967
Phosphorus (P)7723-14-00.002500.050000.00322
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700048.80128
Iron (Fe)7439-89-60.037880.100000.04886
Phosphorus (P)7723-14-00.011360.030000.01466
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.40689
FillerSilica -amorphous-7631-86-91.419396.300001.83100
Silica fused60676-86-016.2216072.0000020.92570
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.58127
PigmentCarbon black1333-86-40.067590.300000.08719
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.63940
Non hazardousProprietary0.991324.400001.27879
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.56943
Post-PlatingPure metalTin (Sn)7440-31-53.85000100.000004.96646
Solder PasteLead alloyLead (Pb)7439-92-16.3362592.500008.17370
Silver (Ag)7440-22-40.171252.500000.22091
Tin (Sn)7440-31-50.342505.000000.44182
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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