Chemical content PHPT610030PK-Q

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Type numberPackagePackage descriptionTotal product weight
PHPT610030PK-QSOT1205LFPAK56D80.85000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346650211151126030 s123520 s3Seremban, Malaysia; Cabuyao, Philippines; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.96000100.000001.18738
ClipCopper alloyCopper (Cu)7440-50-84.9999899.800006.18427
Iron (Fe)7439-89-60.007520.150000.00929
Phosphorus (P)7723-14-00.002500.050000.00310
Lead FrameCopper alloyCopper (Cu)7440-50-835.3292099.8000043.69722
Iron (Fe)7439-89-60.053100.150000.06568
Phosphorus (P)7723-14-00.017700.050000.02189
Mould CompoundAdditiveNon hazardousProprietary1.890805.800002.33865
FillerSilica -amorphous-7631-86-92.053806.300002.54026
Silica fused60676-86-023.4720072.0000029.03154
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.652002.000000.80643
PigmentCarbon black1333-86-40.097800.300000.12096
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.717202.200000.88707
Epoxy resin systemProprietary1.956006.000002.41929
Phenol Formaldehyde resin (generic)9003-35-41.760405.400002.17737
Post-PlatingImpurityNon hazardousProprietary0.000190.010000.00024
Tin alloyTin (Sn)7440-31-51.9298199.990002.38690
Solder PasteLead alloyLead (Pb)7439-92-14.5787592.500005.66327
Silver (Ag)7440-22-40.123752.500000.15306
Tin (Sn)7440-31-50.247505.000000.30612
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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