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Chemical content PMBT3904MB

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Type numberPackagePackage descriptionTotal product weight
PMBT3904MBSOT883BXQFN30.67994 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065892315512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33532
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04620
Phenolic resinProprietary0.0004113.530000.05970
subTotal0.00300100.000000.44122
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.41215
subTotal0.03000100.000004.41215
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09883
Copper (Cu)7440-50-80.2632094.0000038.70930
Tin (Sn)7440-31-50.000670.240000.09883
Zinc (Zn)7440-66-60.000590.210000.08648
Pure metal layerGold (Au)7440-57-50.000220.080000.03294
Nickel (Ni)7440-02-00.013834.940002.03430
Palladium (Pd)7440-05-30.000810.290000.11942
subTotal0.28000100.0000041.18010
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.50101
Silica fused60676-86-00.2040060.0000030.00265
Flame retardantMetal hydroxideProprietary0.010203.000001.50013
ImpurityBismuth (Bi)7440-69-90.001700.500000.25002
PigmentCarbon black1333-86-40.001700.500000.25002
PolymerEpoxy resin systemProprietary0.023807.000003.50031
Phenolic resinProprietary0.020406.000003.00026
subTotal0.34000100.0000050.00440
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93967
subTotal0.02000100.000002.94143
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0069499.990001.01994
subTotal0.00694100.000001.02004
total0.67994100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.