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Chemical content PMDXB550UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDXB550UNESOT1216DFN1010B-61.22915 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069326147212601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01627
FillerSilver (Ag)7440-22-40.0168084.000001.36680
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.16271
Isobornyl Methacrylate7534-94-30.001005.000000.08136
subTotal0.02000100.000001.62714
DieDoped siliconSilicon (Si)7440-21-30.08000100.000006.50856
subTotal0.08000100.000006.50856
Lead FrameCopper alloyChromium (Cr)7440-47-30.001180.240000.09568
Copper (Cu)7440-50-80.4649694.8900037.82785
Tin (Sn)7440-31-50.001180.240000.09568
Zinc (Zn)7440-66-60.001030.210000.08372
Pure metal layerGold (Au)7440-57-50.000240.050000.01993
Nickel (Ni)7440-02-00.020584.200001.67433
Palladium (Pd)7440-05-30.000830.170000.06777
subTotal0.49000100.0000039.86496
Mould CompoundFillerSilica -amorphous-7631-86-90.1403023.0000011.41439
Silica fused60676-86-00.3660060.0000029.77667
Flame retardantMetal hydroxideProprietary0.018303.000001.48883
ImpurityBismuth (Bi)7440-69-90.003050.500000.24814
PigmentCarbon black1333-86-40.003050.500000.24814
PolymerEpoxy resin systemProprietary0.042707.000003.47395
Phenolic resinProprietary0.036606.000002.97767
subTotal0.61000100.0000049.62779
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000010.055500.00090
Tin solderTin (Sn)7440-31-50.0199999.940001.62616
subTotal0.02000100.000001.62713
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0091599.990000.74434
subTotal0.00915100.000000.74441
total1.22915100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.