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Chemical content PMDXB600UNEL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDXB600UNELSOT1216DFN1010B-61.21701 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070432147412601235Sherman, United States Of America; Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong; D-22529 HAMBURG, Germany; Hsinchu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01808
FillerSilver (Ag)7440-22-40.0184884.000001.51848
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18077
Isobornyl Methacrylate7534-94-30.001105.000000.09039
subTotal0.02200100.000001.80772
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.93012
subTotal0.06000100.000004.93012
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.78637
Magnesium (Mg)7439-95-40.000830.170000.06859
Nickel (Ni)7440-02-00.013942.840001.14579
Silicon (Si)7440-21-30.003040.620000.25014
Pure metal layerGold (Au)7440-57-50.000340.070000.02824
Nickel (Ni)7440-02-00.023034.690001.89217
Palladium (Pd)7440-05-30.002110.430000.17348
subTotal0.49100100.0000040.34478
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.45266
Silica fused60676-86-00.3636060.0000029.87650
Flame retardantMetal hydroxideProprietary0.018183.000001.49383
ImpurityBismuth (Bi)7440-69-90.003030.500000.24897
PigmentCarbon black1333-86-40.003030.500000.24897
PolymerEpoxy resin systemProprietary0.042427.000003.48559
Phenolic resinProprietary0.036366.000002.98765
subTotal0.60600100.0000049.79417
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00109
Tin solderTin (Sn)7440-31-50.0239999.940001.97086
subTotal0.02400100.000001.97204
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0140099.990001.15071
subTotal0.01401100.000001.15083
total1.21701100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.