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Chemical content PMEG10030ELP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG10030ELP-QSOD128FlatPower33.88000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662879115112601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.03500100.000003.05490
subTotal1.03500100.000003.05490
ClipCopper alloyCopper (Cu)7440-50-86.8411099.8700020.19213
Iron (Fe)7439-89-60.006850.100000.02022
Phosphorus (P)7723-14-00.002060.030000.00607
subTotal6.85000100.0000020.21842
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.33661
Iron (Fe)7439-89-60.011820.100000.03489
Phosphorus (P)7723-14-00.003550.030000.01047
Pure metal layerSilver (Ag)7440-22-40.171391.450000.50587
subTotal11.82000100.0000034.88784
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.72255
PigmentCarbon black1333-86-40.033960.300000.10024
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.58217
Phenolic resinProprietary1.018809.000003.00708
subTotal11.32000100.0000033.41204
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.03295
subTotal0.35000100.000001.03305
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.82556
Silver alloySilver (Ag)7440-22-40.062502.500000.18447
Tin alloyTin (Sn)7440-31-50.125005.000000.36895
subTotal2.50000100.000007.37898
total33.88000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.