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Chemical content PMEG6010ELR-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG6010ELR-QSOD123WSOD216.75300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662903115112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.40300100.000002.40554
subTotal0.40300100.000002.40554
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700021.99727
Iron (Fe)7439-89-60.003690.100000.02203
Phosphorus (P)7723-14-00.001110.030000.00661
subTotal3.69000100.0000022.02591
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100032.32658
Iron (Fe)7439-89-60.005520.100000.03295
Phosphorus (P)7723-14-00.001660.030000.00988
Pure metal layerSilver (Ag)7440-22-40.097151.760000.57991
subTotal5.52000100.0000032.94932
Mould CompoundFillerSilica fused60676-86-04.4588071.0000026.61493
PigmentCarbon black1333-86-40.018840.300000.11246
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.38471
Phenolic resinProprietary0.565209.000003.37372
subTotal6.28000100.0000037.48582
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.83559
subTotal0.14000100.000000.83568
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.97541
Silver alloySilver (Ag)7440-22-40.018002.500000.10744
Tin alloyTin (Sn)7440-31-50.036005.000000.21489
subTotal0.72000100.000004.29774
total16.75300100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.