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Chemical content PMEG6020AELR-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG6020AELR-QSOD123WSOD217.09000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662889115112601235Suzhou, China; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.74000100.000004.33002
subTotal0.74000100.000004.33002
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700021.56350
Iron (Fe)7439-89-60.003690.100000.02159
Phosphorus (P)7723-14-00.001110.030000.00648
subTotal3.69000100.0000021.59157
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.68913
Iron (Fe)7439-89-60.005520.100000.03230
Phosphorus (P)7723-14-00.001660.030000.00969
Pure metal layerSilver (Ag)7440-22-40.097151.760000.56847
subTotal5.52000100.0000032.29959
Mould CompoundFillerSilica fused60676-86-04.4588071.0000026.09011
PigmentCarbon black1333-86-40.018840.300000.11024
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.23909
Phenolic resinProprietary0.565209.000003.30720
subTotal6.28000100.0000036.74664
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.81911
subTotal0.14000100.000000.81919
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.89702
Silver alloySilver (Ag)7440-22-40.018002.500000.10532
Tin alloyTin (Sn)7440-31-50.036005.000000.21065
subTotal0.72000100.000004.21299
total17.09000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.