Chemical content PMPB25ENE

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Type numberPackagePackage descriptionTotal product weight
PMPB25ENESOT1220SOT12207.37912 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660353115312601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00949
FillerSilver (Ag)7440-22-40.0588084.000000.79684
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09486
Isobornyl Methacrylate7534-94-30.003505.000000.04743
DieDoped siliconSilicon (Si)7440-21-30.47000100.000006.36932
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.65631
Magnesium (Mg)7439-95-40.004220.145900.05714
Nickel (Ni)7440-02-00.084352.918801.14314
Silicon (Si)7440-21-30.018280.632400.24768
Pure metal layerGold (Au)7440-57-50.000960.033300.01304
Nickel (Ni)7440-02-00.074012.561001.00300
Palladium (Pd)7440-05-30.003270.113000.04426
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.62605
Silica fused60676-86-02.2380060.0000030.32882
Flame retardantMetal hydroxideProprietary0.111903.000001.51644
ImpurityBismuth (Bi)7440-69-90.018650.500000.25274
PigmentCarbon black1333-86-40.018650.500000.25274
PolymerEpoxy resin systemProprietary0.261107.000003.53836
Phenolic resinProprietary0.223806.000003.03288
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1699099.940002.30242
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0491199.990000.66558
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.