×

Chemical content PMV50XP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMV50XPSOT23TO-236AB8.96813 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068894215312601235Bangkok, Thailand; Dongguan, China; Kwai Chung, Hong Kong; Kuching Sarawak, Malaysia; Nantong, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34344
PolymerResin systemProprietary0.0092023.000000.10259
subTotal0.04000100.000000.44603
DieAluminium alloyAluminium (Al)7429-90-50.000450.280000.00500
Doped siliconSilicon (Si)7440-21-30.1595599.720001.77910
subTotal0.16000100.000001.78410
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.53203
Iron (Fe)7439-89-60.082912.520000.92447
Lead (Pb)7439-92-10.000990.030000.01101
Phosphorus (P)7723-14-00.004940.150000.05503
Zinc (Zn)7440-66-60.006250.190000.06970
Pure metal layerSilver (Ag)7440-22-40.098042.980001.09323
subTotal3.29000100.0000036.68547
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23179
FillerSilica -amorphous-7631-86-90.014700.290000.16395
Silica fused60676-86-04.3678086.1500048.70363
HardenerPhenolic resinProprietary0.217504.290002.42529
PigmentCarbon black1333-86-40.009630.190000.10741
PolymerEpoxy resin systemProprietary0.439578.670004.90146
subTotal5.07000100.0000056.53353
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00217
Tin solderTin (Sn)7440-31-50.3497999.940003.90037
subTotal0.35000100.000003.90272
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0070399.990000.07837
subTotal0.00703100.000000.07838
WireImpurityNon hazardousProprietary0.000010.010000.00006
Pure metalCopper (Cu)7440-50-80.0510999.990000.56974
subTotal0.05110100.000000.56980
total8.96813100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.