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Chemical content PMV65ENEA

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Type numberPackagePackage descriptionTotal product weight
PMV65ENEASOT23TO-236AB8.90934 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070123215512601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34570
PolymerResin systemProprietary0.0092023.000000.10326
subTotal0.04000100.000000.44896
DieDoped siliconSilicon (Si)7440-21-30.13000100.000001.45914
subTotal0.13000100.000001.45914
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.75989
Iron (Fe)7439-89-60.082912.520000.93057
Lead (Pb)7439-92-10.000990.030000.01108
Phosphorus (P)7723-14-00.004940.150000.05539
Zinc (Zn)7440-66-60.006250.190000.07016
Pure metal layerSilver (Ag)7440-22-40.098042.980001.10044
subTotal3.29000100.0000036.92753
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23332
FillerSilica -amorphous-7631-86-90.014700.290000.16503
Silica fused60676-86-04.3678086.1500049.02501
HardenerPhenolic resinProprietary0.217504.290002.44129
PigmentCarbon black1333-86-40.009630.190000.10812
PolymerEpoxy resin systemProprietary0.439578.670004.93380
subTotal5.07000100.0000056.90657
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00218
Tin solderTin (Sn)7440-31-50.3497999.940003.92610
subTotal0.35000100.000003.92846
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0293399.990000.32926
subTotal0.02934100.000000.32929
total8.90934100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.