×

Chemical content PMXB350UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMXB350UPESOT1215DFN1010D-31.17058 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067152147512601235Sherman, United States Of America; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000301.000000.02563
FillerSilver (Ag)7440-22-40.0252084.000002.15278
PolymerBismaleimidodiphenylmethane resin 0.0030010.000000.25628
Isobornyl Methacrylate7534-94-30.001505.000000.12814
subTotal0.03000100.000002.56283
DieDoped siliconSilicon (Si)7440-21-30.05000100.000004.27139
subTotal0.05000100.000004.27139
Lead FrameCopper alloyChromium (Cr)7440-47-30.001270.240000.10866
Copper (Cu)7440-50-80.5009094.5100042.79101
Tin (Sn)7440-31-50.001270.240000.10866
Zinc (Zn)7440-66-60.001110.210000.09508
Pure metal layerGold (Au)7440-57-50.000370.070000.03169
Nickel (Ni)7440-02-00.022954.330001.96048
Palladium (Pd)7440-05-30.002120.400000.18111
subTotal0.53000100.0000045.27669
Mould CompoundFillerSilica -amorphous-7631-86-90.1173023.0000010.02067
Silica fused60676-86-00.3060060.0000026.14089
Flame retardantMetal hydroxideProprietary0.015303.000001.30704
ImpurityBismuth (Bi)7440-69-90.002550.500000.21784
PigmentCarbon black1333-86-40.002550.500000.21784
PolymerEpoxy resin systemProprietary0.035707.000003.04977
Phenolic resinProprietary0.030606.000002.61409
subTotal0.51000100.0000043.56814
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00012
Non hazardousProprietary0.000020.055500.00142
Tin solderTin (Sn)7440-31-50.0299899.940002.56129
subTotal0.03000100.000002.56283
WireImpurityNon hazardousProprietary0.000000.010000.00018
Pure metalGold (Au)7440-57-50.0205799.990001.75753
subTotal0.02058100.000001.75771
total1.17058100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.