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Chemical content PMZ350UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZ350UPESOT883XQFN30.87592 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068442315312601235Sherman, United States Of America; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86766
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11953
Phenolic resinProprietary0.0013513.530000.15447
subTotal0.01000100.000001.14166
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.70828
subTotal0.05000100.000005.70828
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.85613
Magnesium (Mg)7439-95-40.000630.146000.07167
Nickel (Ni)7440-02-00.012532.913001.43003
Silicon (Si)7440-21-30.002710.631000.30977
MetallisationGold (Au)7440-57-50.000150.035000.01718
Nickel (Ni)7440-02-00.011852.755001.35246
Palladium (Pd)7440-05-30.000470.110000.05400
subTotal0.43000100.0000049.09124
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.71550
Silica fused60676-86-00.2220060.0000025.34478
Flame retardantMetal hydroxideProprietary0.011103.000001.26724
ImpurityBismuth (Bi)7440-69-90.001850.500000.21121
PigmentCarbon black1333-86-40.001850.500000.21121
PolymerEpoxy resin systemProprietary0.025907.000002.95689
Phenolic resinProprietary0.022206.000002.53448
subTotal0.37000100.0000042.24131
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.14097
subTotal0.01000100.000001.14165
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0059299.990000.67545
subTotal0.00592100.000000.67552
total0.87592100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.