Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PQMH11

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PQMH11SOT1216DFN1010B-61.237134 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340697371473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01760080.0000001.422643
PolymerAcrylic resinProprietary0.00440020.0000000.355661
subTotal0.022000100.0000001.778304
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000006.466559
subTotal0.080000100.0000006.466559
Lead FrameCopper alloyCopper (Cu)7440-50-80.44769491.18000036.187980
Magnesium (Mg)7439-95-40.0008350.1700000.067470
Nickel (Ni)7440-02-00.0139442.8400001.127154
Silicon (Si)7440-21-30.0030440.6200000.246069
Pure metal layerGold (Au)7440-57-50.0003440.0700000.027782
Nickel (Ni)7440-02-00.0230284.6900001.861391
Palladium (Pd)7440-05-30.0021110.4300000.170661
subTotal0.491000100.00000039.688506
Mould CompoundFillerSilica -amorphous-7631-86-90.13938023.00000011.266362
Silica fused60676-86-00.36360060.00000029.390511
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0181803.0000001.469526
Ion trapping agentBismuth (Bi)7440-69-90.0030300.5000000.244921
PigmentCarbon black1333-86-40.0030300.5000000.244921
PolymerEpoxy resin systemProprietary0.0424207.0000003.428893
Phenolic resinProprietary0.0363606.0000002.939051
subTotal0.606000100.00000048.984184
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000087
Non hazardousProprietary0.0000130.0555000.001077
Tin solderTin (Sn)7440-31-50.02398699.9400001.938804
subTotal0.024000100.0000001.939968
WireImpurityNon hazardousProprietary0.0000010.0100000.000114
Pure metalGold (Au)7440-57-50.01413299.9900001.142341
subTotal0.014134100.0000001.142455
total1.237134100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.