Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PRMH10

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PRMH10SOT1268-1DFN1412-62.376000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070178147312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10640076.0000004.478114
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.01465810.4700000.616919
Phenolic resinProprietary0.01894213.5300000.797222
subTotal0.140000100.0000005.892256
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000003.367003
subTotal0.080000100.0000003.367003
Lead FrameCopper alloyCopper (Cu)7440-50-80.91850995.67800038.657778
Magnesium (Mg)7439-95-40.0014320.1492000.060283
Nickel (Ni)7440-02-00.0286442.9837001.205535
Silicon (Si)7440-21-30.0062060.6465000.261212
Pure metal layerGold (Au)7440-57-50.0001090.0114000.004606
Nickel (Ni)7440-02-00.0047570.4955000.200202
Palladium (Pd)7440-05-30.0003430.0357000.014424
subTotal0.960000100.00000040.404040
Mould CompoundFillerSilica -amorphous-7631-86-90.25990023.00000010.938552
Silica fused60676-86-00.67800060.00000028.535354
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0339003.0000001.426768
Ion trapping agentBismuth (Bi)7440-69-90.0056500.5000000.237795
PigmentCarbon black1333-86-40.0056500.5000000.237795
PolymerEpoxy resin systemProprietary0.0791007.0000003.329125
Phenolic resinProprietary0.0678006.0000002.853535
subTotal1.130000100.00000047.558923
Post-PlatingImpurityLead (Pb)7439-92-10.0000020.0045000.000095
Non hazardousProprietary0.0000280.0555000.001168
Tin solderTin (Sn)7440-31-50.04997099.9400002.103114
subTotal0.050000100.0000002.104377
WireImpurityNon hazardousProprietary0.0000020.0100000.000067
Pure metalGold (Au)7440-57-50.01599899.9900000.673333
subTotal0.016000100.0000000.673401
total2.376000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.