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Chemical content PSMN020-30MLC

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Type numberPackagePackage descriptionTotal product weight
PSMN020-30MLCSOT1210mLFPAK35.30000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067357115512601260Manchester, United Kingdom; Sherman, United States Of America; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.48000100.000001.35977
subTotal0.48000100.000001.35977
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000016.11501
Iron (Fe)7439-89-60.008550.150000.02422
Phosphorus (P)7723-14-00.002850.050000.00807
subTotal5.70000100.0000016.14730
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000039.29802
Iron (Fe)7439-89-60.020850.150000.05907
Phosphorus (P)7723-14-00.006950.050000.01969
subTotal13.90000100.0000039.37678
Mould CompoundFillerSilica fused60676-86-06.0563071.0000017.15666
PigmentCarbon black1333-86-40.025590.300000.07249
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.6804119.700004.76037
Phenolic resinProprietary0.767709.000002.17479
subTotal8.53000100.0000024.16431
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00109
Tin alloyTin (Sn)7440-31-53.8496299.9900010.90542
subTotal3.85000100.0000010.90651
Solder PasteLead alloyLead (Pb)7439-92-12.5807592.500007.31091
Silver (Ag)7440-22-40.069752.500000.19759
Tin (Sn)7440-31-50.139505.000000.39518
subTotal2.79000100.000007.90368
total35.30000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.