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Chemical content PTVS33VS1UR/8

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Type numberPackagePackage descriptionTotal product weight
PTVS33VS1UR/8SOD123WSOD217.13000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660626115212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.78000100.000004.55342
subTotal0.78000100.000004.55342
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700021.51315
Iron (Fe)7439-89-60.003690.100000.02154
Phosphorus (P)7723-14-00.001110.030000.00646
subTotal3.69000100.0000021.54115
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.61513
Iron (Fe)7439-89-60.005520.100000.03222
Phosphorus (P)7723-14-00.001660.030000.00967
Pure metal layerSilver (Ag)7440-22-40.097151.760000.56715
subTotal5.52000100.0000032.22417
Mould CompoundFillerSilica fused60676-86-04.4588071.0000026.02919
PigmentCarbon black1333-86-40.018840.300000.10998
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.22218
Phenolic resinProprietary0.565209.000003.29947
subTotal6.28000100.0000036.66082
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.81720
subTotal0.14000100.000000.81728
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.88792
Silver alloySilver (Ag)7440-22-40.018002.500000.10508
Tin alloyTin (Sn)7440-31-50.036005.000000.21016
subTotal0.72000100.000004.20316
total17.13000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.