Chemical content TDZ24J

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Type numberPackagePackage descriptionTotal product weight
TDZ24JSOD323FSOD323F3.78328 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934065797115712601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000001.32160
Lead FrameCopper alloyCopper (Cu)7440-50-81.4745297.6500038.97451
Iron (Fe)7439-89-60.031862.110000.84215
Phosphorus (P)7723-14-00.000450.030000.01197
Zinc (Zn)7440-66-60.001960.130000.05189
Pure metal layerSilver (Ag)7440-22-40.001210.080000.03193
Mould CompoundFillerSilica fused60676-86-01.6071475.1000042.48007
PigmentCarbon black1333-86-40.006420.300000.16969
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3745017.500009.89882
Phenol Formaldehyde resin (generic)9003-35-40.151947.100004.01609
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000040.055500.00117
Tin solderTin (Sn)7440-31-50.0799599.940002.11330
WirePure metalCopper (Cu)7440-50-80.00328100.000000.08664
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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