Chemical content TL431MFDT

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Type numberPackagePackage descriptionTotal product weight
TL431MFDTSOT23TO-236AB9.18253 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935293277215712601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.33542
PolymerResin systemProprietary0.0092023.000000.10019
DieDoped siliconSilicon (Si)7440-21-30.41000100.000004.46500
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.72575
Iron (Fe)7439-89-60.082912.520000.90289
Lead (Pb)7439-92-10.000990.030000.01075
Phosphorus (P)7723-14-00.004940.150000.05374
Zinc (Zn)7440-66-60.006250.190000.06807
Pure metal layerSilver (Ag)7440-22-40.098042.980001.06770
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22638
FillerSilica -amorphous-7631-86-90.014700.290000.16012
Silica fused60676-86-04.3678086.1500047.56647
HardenerPhenolic resinProprietary0.217504.290002.36866
PigmentCarbon black1333-86-40.009630.190000.10491
PolymerEpoxy resin systemProprietary0.439578.670004.78701
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00212
Tin solderTin (Sn)7440-31-50.3497999.940003.80930
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0225399.990000.24533
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.