×

Chemical content XS3A1T5157GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
XS3A1T5157GMSOT886XSON62.01903 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690971115512601235Bangkok, Thailand; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.15156100.000007.50661
subTotal0.15156100.000007.50661
ComponentAdditiveNon hazardousProprietary0.000255.000000.01238
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01238
Silica -amorphous-7631-86-90.0025050.000000.12382
PolymerEpoxy resin systemProprietary0.0015030.000000.07429
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02476
subTotal0.00500100.000000.24763
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100036.13702
Magnesium (Mg)7439-95-40.001160.150000.05735
Nickel (Ni)7440-02-00.022772.950001.12797
Silicon (Si)7440-21-30.004940.640000.24471
Pure metal layerGold (Au)7440-57-50.000150.020000.00765
Nickel (Ni)7440-02-00.012661.640000.62707
Palladium (Pd)7440-05-30.000690.090000.03441
subTotal0.77200100.0000038.23618
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.21647
FillerSilica -amorphous-7631-86-90.003090.290000.15311
Silica fused60676-86-00.9183686.1500045.48516
HardenerPhenolic resinProprietary0.045734.290002.26502
PigmentCarbon black1333-86-40.002030.190000.10032
PolymerEpoxy resin systemProprietary0.092428.670004.57755
subTotal1.06600100.0000052.79763
WireGold alloyGold (Au)7440-57-50.0242299.000001.19960
Palladium (Pd)7440-05-30.000241.000000.01212
subTotal0.02446100.000001.21172
total2.01903100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.