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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74HCS125-Q100

Quad buffer/line driver with Schmitt-trigger inputs and 3-state outputs

The 74HCS125-Q100 is a quad buffer/line driver with 3-state outputs controlled by the output enable inputs (nOE). A HIGH on nOE causes the outputs to assume a high impedance OFF-state. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V
  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

Parametrics

Type number VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74HCS125BQ-Q100 2.0 - 6.0 CMOS ± 7.8 5 4 low -40~125 109 22.9 76.7 DHVQFN14
74HCS125D-Q100 2.0 - 6.0 CMOS ± 7.8 5 4 low -40~125 112 22.7 70.4 SO14
74HCS125PW-Q100 2.0 - 6.0 CMOS ± 7.8 5 4 low -40~125 144 8.5 69.7 TSSOP14

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74HCS125BQ-Q100 74HCS125BQ-Q100X
(935692061115)		 Active S125 SOT762-1
DHVQFN14
(SOT762-1) 		SOT762-1 SOT762-1_115
74HCS125D-Q100 74HCS125D-Q100J
(935692059118)		 Active 74HCS125D SOT108-1
SO14
(SOT108-1) 		SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74HCS125PW-Q100 74HCS125PW-Q100J
(935692060118)		 Active HCS125 SOT402-1
TSSOP14
(SOT402-1) 		SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74HCS125BQ-Q100 74HCS125BQ-Q100X 74HCS125BQ-Q100 rohs rhf rhf
74HCS125D-Q100 74HCS125D-Q100J 74HCS125D-Q100 rohs rhf rhf
74HCS125PW-Q100 74HCS125PW-Q100J 74HCS125PW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (17)

File name Title Type Date
74HCS125_Q100 Quad buffer/line driver with Schmitt-trigger inputs and 3-state outputs Data sheet 2025-07-21
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs125 74HCS125 IBIS Model IBIS model 2025-07-01
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs125 74HCS125 IBIS Model IBIS model 2025-07-01

Ordering, pricing & availability

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