74HCS125-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HCS125BQ-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 5 | 4 | low | -40~125 | 109 | 22.9 | 76.7 | DHVQFN14 |
| 74HCS125D-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 5 | 4 | low | -40~125 | 112 | 22.7 | 70.4 | SO14 |
| 74HCS125PW-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 5 | 4 | low | -40~125 | 144 | 8.5 | 69.7 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HCS125BQ-Q100 | 74HCS125BQ-Q100X (935692061115) |
Active | S125 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HCS125D-Q100 | 74HCS125D-Q100J (935692059118) |
Active | 74HCS125D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HCS125PW-Q100 | 74HCS125PW-Q100J (935692060118) |
Active | HCS125 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HCS125BQ-Q100 | 74HCS125BQ-Q100X | 74HCS125BQ-Q100 |
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| 74HCS125D-Q100 | 74HCS125D-Q100J | 74HCS125D-Q100 |
|
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| 74HCS125PW-Q100 | 74HCS125PW-Q100J | 74HCS125PW-Q100 |
|
|
Documentation (16)
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| 74hcs125 | 74HCS125 IBIS Model | IBIS model | 2025-07-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| 74hcs125 | 74HCS125 IBIS Model | IBIS model | 2025-07-01 |
Ordering, pricing & availability
Sample
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