Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
SOT8063-2 | HSO8 | HSO8: Plastic, thermal enhanced small outline package; 8 leads; 1.27 mm pitch; 4.9 mm × 3.9 mm × 1.7 mm body | MS-012 (JEDEC) | 2025-04-09 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
SOT8063-2 | HSO8: Plastic, thermal enhanced small outline package; 8 leads;1.27 mm pitch; 4.9 mm × 3.9 mm × 1.7 mm body | Package information | 2025-04-14 |
SOT8063-2_518 | HSO8; Reel dry pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-07-14 |
Products in this package
Analog & Logic ICs
Type number | Description | Quick access |
---|---|---|
NEX91515PB-Q100 | Automotive 150 mA, 40 V tracking LDO with 5 mV tolerance | |
NEX91530PB-Q100 | Automotive 300 mA, 40 V tracking LDO with 5 mV tolerance | |
NEX91630PB-Q100 | Automotive 300 mA, 40 V tracking LDO with 5 mV tolerance | |
NEX91615PB-Q100 | Automotive 150 mA, 40 V tracking LDO with 5 mV tolerance |