Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8019-1 | WLCSP12 | wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm | 2020-08-12 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| SOT8019-1 | 3D model for products with SOT8019-1 package | Design support | 2023-02-07 |
| SOT8019-1 | wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm | Package information | 2022-02-11 |
| SOT8019-1_336 | WLCSP12; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-03-03 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NXS0104UM | Dual supply translating transceiver; open drain; auto direction sensing |