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wafer level chip-scale package; 8 bumps; 1.42 × 0.72 × 0.465 mm body
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP8_SOT8068 | WLCSP8_SOT8068 | wafer level chip-scale package; 8 bumps; 1.42 × 0.72 × 0.465 mm body | 2024-01-22 |
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| WLCSP8_SOT8068 | wafer level chip-scale package; 8 bumps; 1.42 × 0.72 × 0.465 mm body | Package information | 2024-01-25 |