SOT1160-1

XQFN10 (SOT1160-1)

plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body

Outline drawing

Package version Package name Package description Reference Issue date
SOT1160-1 XQFN10 plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body - - - (EIAJ) ; - - - (JEDEC) ; - - - (IEC) 2009-12-29

Related documents

File name Title Type Date
REFLOW_BG-BD-1 Reflow soldering profile Other type 2017-12-01
XQFN10_SOT1160-1_mk plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body Marcom graphics 2017-01-28
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03

Products in this package

Automotive qualified products (AEC-Q100/Q101)
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