Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT371-1 | SSOP56 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | MO-118 (JEDEC) | 2003-02-18 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT371-1 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|