SO8 (SOT96-1)

plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

Package version	Package name	Package description	Reference	Issue date
SOT96-1	SO8	plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body	MS-012 (JEDEC) ; 076E03 (IEC)	2003-02-18

File name	Title	Type	Date
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SO8_SOT96-1_mk	plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body	Marcom graphics	2017-01-28
SO-SOJ-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08
SO-SOJ-REFLOW	Footprint for reflow soldering	Reflow soldering	2009-10-08
Nexperia_package_poster	Nexperia package poster	Leaflet	2019-03-01