WLCSP15_6-3-6

WLCSP15 (WLCSP15_6-3-6)

wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body

Package information

Package version Package name Package description Reference Issue date
WLCSP15_6-3-6 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body 2010-02-11

Related documents

File name Title Type Date
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

Products in this package

ESD protection, TVS, filtering and signal conditioning
Type number Description Quick access
PCMF3HDMI14S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3HDMI2S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB30 Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB3B Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF3USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF3USB3S Common-mode EMI filter for differential channels with integrated ESD protection
PESD3USB30 ESD protection for differential data lines
PESD3USB3B ESD protection for differential data lines
PESD3USB3S ESD protection for differential data lines