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WLCSP15_6-3-6

WLCSP15_6-3-6

wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body

Package information

Package information Package name Package description Reference Date
WLCSP15_6-3-6 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body 2010-02-11

Related documents

File name Title Type Date
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 PCMF3USB3X, PCMF3HDMI2X and PESD3USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing information 2020-04-27

Products in this package

ESD protection, TVS, filtering and signal conditioning

Type number Description Quick access
PESD3USB30 ESD protection for differential data lines
PCMF3USB3S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF3USB30 Common-mode EMI filter for differential channels with integrated ESD protection
PESD3USB3S ESD protection for differential data lines
PCMF3HDMI14S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB3B Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PESD3USB3B ESD protection for differential data lines
PCMF3HDMI2S Common-mode EMI filter for differential channels with integrated ESD protection