Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

WLCSP15_6-3-6

WLCSP15_6-3-6

wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body

Package information

Package information Package name Package description Reference Date
WLCSP15_6-3-6 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body 2010-02-11

Related documents

File name Title Type Date
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 PCMF3USB3X, PCMF3HDMI2X and PESD3USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing information 2020-04-27

Products in this package

ESD protection, TVS, filtering and signal conditioning

Type number Description Quick access
PCMF3HDMI14S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB30 Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB3B Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF3USB3S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3HDMI2S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF3USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PESD3USB3S ESD protection for differential data lines
PESD3USB3B ESD protection for differential data lines
PESD3USB30 ESD protection for differential data lines