Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP8-SOT8072 | WLCSP8 | wafer level chip-scale package; 8 solder bars; body: 3.5 x 2.13 x 0.429 mm | MO-211 compatible (JEDEC) | 2023-03-03 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| WLCSP8-SOT8072 | wafer level chip-scale package; 8 solder bars; body: 3.5 x 2.13 x 0.429 mm | Package information | 2023-03-21 |
| WLCSP8-SOT8072_341 | WLCSP8; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2023-04-18 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GAN3R2-100CBE | 100 V, 3.2 mOhm Gallium Nitride (GaN) FET in a 3.5 mm x 2.13 mm Wafer Level Chip-Scale Package (WLCSP) |