Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP9_SOT8134 | WLCSP9 | WLCSP9: wafer level chip-scale package; 9 bumps; 1.500 × 1.500 × 0.663 mm body | 2025-07-08 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP9_SOT8134 | WLCSP9: wafer level chip-scale package; 9 bumps; 1.500 × 1.500 × 0.663 mm body | Package information | 2025-11-25 |
| WLCSP9_SOT8134_341 | WLCSP9; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2025-09-03 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GANE011-080CBA | AEC-Q101 qualified 80 V, 11 mOhm Gallium Nitride (GaN) FET in a 1.5 mm x 1.5 mm Wafer Level Chip-Scale Package (WLCSP) |