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BSP230

P-channel vertical D-MOS intermediate level FET

P-channel enhancement mode vertical Double-Diffused Field-Effect Transistor (D-MOSFET) in a SOT89 (SC-62) medium power and flat lead Surface Mounted Device (SMD) plastic package.

This product has been discontinued

Features and benefits

  • Direct interface to Complementary (C-MOS) transitor and Transistor-Transistor Logic (TTL) devices

  • Very fast switching

  • No secondary breakdown

Applications

  • High-speed line drivers

  • Line current interruptors in telephone sets

  • Line transformer drivers

  • Relay drivers

Parametrics

Type number Package version Package name Product status Channel type VDS [max] (V) Ptot [max] (W) Release date
BSP230 SOT223 SC-73 End of life P -300 1.5 2011-01-24

Package

All type numbers in the table below are discontinued.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
BSP230 BSP230,135
(934024380135)		 Discontinued / End-of-life BSP230 SOT223
SC-73
(SOT223) 		SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_135

Environmental information

All type numbers in the table below are discontinued.

Type number Orderable part number Chemical content RoHS RHF-indicator
BSP230 BSP230,135 BSP230 rohs rhf rhf
Quality and reliability disclaimer

Documentation (18)

File name Title Type Date
BSP230 P-channel enhancement mode vertical D-MOS transistor Data sheet 2010-02-16
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BSP230_15_03_2012 BSP230.15_03_2012 Spice parameter S-parameter 2012-04-12
BSP230 BSP230 SPICE model SPICE model 2012-06-08
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
BSP230_15_03_2012 BSP230.15_03_2012 Spice parameter S-parameter 2012-04-12
BSP230 BSP230 SPICE model SPICE model 2012-06-08
SOT223 3D model for products with SOT223 package Design support 2019-01-22

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet