NEVB-LOGIC04 - DIL footprint (XSON / DHXQFN) adapter board
NEVB-LOGIC04 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
NEVB-LOGIC04 footprint adapter board
Key features & benefits
Plug and play: identify the package you will be using, place the device in the footprint and solder the device down to start evaluating
Packages on the board (5)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
XSON5 (SOT8065-1) |
XSON5 | SOT8065-1 | Plastic thermal enhanced extremely thin small outline package with side-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | MO-340 (JEDEC) | 2024-08-27 |
DHXQFN14 (SOT8014-1) |
DHXQFN14 | SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | 2020-09-22 | |
DHXQFN16 (SOT8016-1) |
DHXQFN16 | SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | 2020-09-22 | |
DHXQFN20 (SOT8020-1) |
DHXQFN20 | SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 | |
DHXQFN24 (SOT8024-1) |
DHXQFN24 | SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
NEVB-LOGIC01---DIL-footprint--TSSOP---DHVQFN---XQFN--adapter-board | NEVB-LOGIC01 - DIL footprint (TSSOP / DHVQFN / XQFN) adapter board | Evaluation board | Order | |
|
NEVB-LOGIC02---DIL-footprint--XSON---X2SON---TSSOP---VSSOP--adapter-board | NEVB-LOGIC02 - DIL footprint (XSON / X2SON / TSSOP / VSSOP) adapter board | Evaluation board | Order | |
|
NEVB-LOGIC03---DIL-footprint--WLCSP--adapter-board | NEVB-LOGIC03 - DIL footprint (WLCSP) adapter board | Evaluation board | Order |
Packages on the board (5)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
|
XSON5 (SOT8065-1) |
XSON5 | SOT8065-1 | Plastic thermal enhanced extremely thin small outline package with side-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | MO-340 (JEDEC) | 2024-08-27 |
|
DHXQFN14 (SOT8014-1) |
DHXQFN14 | SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN16 (SOT8016-1) |
DHXQFN16 | SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN20 (SOT8020-1) |
DHXQFN20 | SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN24 (SOT8024-1) |
DHXQFN24 | SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
NEVB-LOGIC01---DIL-footprint--TSSOP---DHVQFN---XQFN--adapter-board | NEVB-LOGIC01 - DIL footprint (TSSOP / DHVQFN / XQFN) adapter board | Evaluation board | Order | |
|
|
NEVB-LOGIC02---DIL-footprint--XSON---X2SON---TSSOP---VSSOP--adapter-board | NEVB-LOGIC02 - DIL footprint (XSON / X2SON / TSSOP / VSSOP) adapter board | Evaluation board | Order | |
|
|
NEVB-LOGIC03---DIL-footprint--WLCSP--adapter-board | NEVB-LOGIC03 - DIL footprint (WLCSP) adapter board | Evaluation board | Order |
Documentation (7)
| File name | Title | Type | Date |
|---|---|---|---|
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2026-06-04 |
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-09-24 |
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2026-06-04 |
Support
Please contact us if you have any questions. If you are in need of design support, please fill in the technical support form, we will get back to you shortly.
Please visit our engineer exchange forum or contact us for further support.