Chemical content 74AHC86D-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC86D-Q100SOT108-1SO14142.09490 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301397118812601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2403080.100000.16911
PolymerResin systemProprietary0.0597019.900000.04201
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.28030
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.60292
Iron (Fe)7439-89-61.175702.400000.82740
Phosphorus (P)7723-14-00.014700.030000.01034
Zinc (Zn)7440-66-60.048990.100000.03448
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.01276
FillerSilica fused60676-86-071.9567679.0000050.63993
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.84607
PigmentCarbon black1333-86-40.182170.200000.12820
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.56405
Non hazardousProprietary3.734464.100002.62815
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28202
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02625
Nickel (Ni)7440-02-01.1477892.300000.80775
Palladium (Pd)7440-05-30.038553.100000.02713
Silver (Ag)7440-22-40.019901.600000.01400
WirePure metalCopper (Cu)7440-50-80.08116100.000000.05712
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.