Chemical content 74AUP1G158GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1G158GSSOT1202X2SON60.98015 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935292852132812601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04510100.000004.60164
ComponentAdditiveNon hazardousProprietary0.000255.000000.02551
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02551
Silica -amorphous-7631-86-90.0025050.000000.25506
PolymerEpoxy resin systemProprietary0.0015030.000000.15304
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05101
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100040.59451
Magnesium (Mg)7439-95-40.000630.150000.06443
Nickel (Ni)7440-02-00.012422.950001.26710
Silicon (Si)7440-21-30.002690.640000.27490
Pure metal layerGold (Au)7440-57-50.000080.020000.00859
Nickel (Ni)7440-02-00.006901.640000.70442
Palladium (Pd)7440-05-30.000380.090000.03866
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20539
FillerSilica -amorphous-7631-86-90.001420.290000.14527
Silica fused60676-86-00.4230086.1500043.15630
HardenerPhenolic resinProprietary0.021064.290002.14905
PigmentCarbon black1333-86-40.000930.190000.09518
PolymerEpoxy resin systemProprietary0.042578.670004.34318
WireGold alloyGold (Au)7440-57-50.0178799.000001.82314
Palladium (Pd)7440-05-30.000181.000000.01842
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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