Chemical content 74AUP1G32GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1G32GMSOT886XSON61.91689 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352790271321612601235Seremban, Malaysia; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands 
9352790271151812601235Nijmegen, Netherlands; Bangkok, Thailand; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06291100.000003.28188
ComponentAdditiveNon hazardousProprietary0.000255.000000.01304
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01304
Silica -amorphous-7631-86-90.0025050.000000.13042
PolymerEpoxy resin systemProprietary0.0015030.000000.07825
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02608
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.06255
Magnesium (Mg)7439-95-40.001160.150000.06041
Nickel (Ni)7440-02-00.022772.950001.18807
Silicon (Si)7440-21-30.004940.640000.25775
Pure metal layerGold (Au)7440-57-50.000150.020000.00805
Nickel (Ni)7440-02-00.012661.640000.66049
Palladium (Pd)7440-05-30.000690.090000.03625
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22779
FillerSilica -amorphous-7631-86-90.003090.290000.16112
Silica fused60676-86-00.9175086.1500047.86386
HardenerPhenolic resinProprietary0.045694.290002.38347
PigmentCarbon black1333-86-40.002020.190000.10556
PolymerEpoxy resin systemProprietary0.092348.670004.81694
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0115696.490000.60293
Pure metal layerGold (Au)7440-57-50.000060.500000.00312
Palladium (Pd)7440-05-30.000363.000000.01875
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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