Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G57GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G57GNSOT1115X2SON60.869023 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352917431324126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.027823100.0000003.201641
subTotal0.027823100.0000003.201641
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.028768
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.028768
Silica -amorphous-7631-86-90.00250050.0000000.287679
PolymerEpoxy resin systemProprietary0.00150030.0000000.172608
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.057536
subTotal0.005000100.0000000.575359
Lead FrameCopper alloyCopper (Cu)7440-50-80.36386494.51000041.870411
Magnesium (Mg)7439-95-40.0005780.1500000.066454
Nickel (Ni)7440-02-00.0113582.9500001.306927
Silicon (Si)7440-21-30.0024640.6400000.283537
Pure metal layerGold (Au)7440-57-50.0000770.0200000.008861
Nickel (Ni)7440-02-00.0063141.6400000.726563
Palladium (Pd)7440-05-30.0003460.0900000.039872
subTotal0.385000100.00000044.302625
Mould CompoundAdditiveNon hazardousProprietary0.0017840.4100000.205230
FillerSilica -amorphous-7631-86-90.0012620.2900000.145163
Silica fused60676-86-00.37475286.15000043.123427
HardenerPhenolic resinProprietary0.0186624.2900002.147412
PigmentCarbon black1333-86-40.0008260.1900000.095107
PolymerEpoxy resin systemProprietary0.0377148.6700004.339874
subTotal0.435000100.00000050.056213
WireGold alloyGold (Au)7440-57-50.01603899.0000001.845521
Palladium (Pd)7440-05-30.0001621.0000000.018642
subTotal0.016200100.0000001.864162
total0.869023100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.