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Chemical content 74AUP2G04GN

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Type numberPackagePackage descriptionTotal product weight
74AUP2G04GNSOT1115X2SON60.86614 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291759132412601235Nijmegen, Netherlands; Seremban, Malaysia; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02481100.000002.86495
subTotal0.02481100.000002.86495
ComponentAdditiveNon hazardousProprietary0.000255.000000.02886
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02886
Silica -amorphous-7631-86-90.0025050.000000.28864
PolymerEpoxy resin systemProprietary0.0015030.000000.17318
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05773
subTotal0.00500100.000000.57727
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.00978
Magnesium (Mg)7439-95-40.000580.150000.06668
Nickel (Ni)7440-02-00.011362.950001.31128
Silicon (Si)7440-21-30.002460.640000.28448
Pure metal layerGold (Au)7440-57-50.000080.020000.00889
Nickel (Ni)7440-02-00.006311.640000.72898
Palladium (Pd)7440-05-30.000350.090000.04001
subTotal0.38500100.0000044.45010
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20591
FillerSilica -amorphous-7631-86-90.001260.290000.14565
Silica fused60676-86-00.3747586.1500043.26697
HardenerPhenolic resinProprietary0.018664.290002.15456
PigmentCarbon black1333-86-40.000830.190000.09542
PolymerEpoxy resin systemProprietary0.037718.670004.35432
subTotal0.43500100.0000050.22283
WireGold alloyGold (Au)7440-57-50.0161799.000001.86652
Palladium (Pd)7440-05-30.000161.000000.01885
subTotal0.01633100.000001.88537
total0.86614100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.